PhasePlane™ is an aluminum-extrusion, grooved-wick, heat pipe. Its application into the electronics cooling industry has many advantages over standard, copper, and sintered-wick heat pipes. These advantages include mass manufacturability, ease of application, low weight, and improved performance. The flat sides of the PhasePlane™ provide a compatible mating surface to semiconductor chips and processors making them easy to implement into complex designs. PhasePlanes™ are stackable, bendable, and bondable. The thin-walled aluminum extrusion used to make PhasePlanes™ provide incredibly light, low profile thermal solutions. Performance of the PhasePlane™ has proven to be superior to the published sintered-wick heat pipe data in the gravity aided vertical and horizontal orientations. Additionally, the junctions between the PhasePlane™ and the flat chips and heat sinks have low thermal resistance, thereby adding to the improved performance.